Multilayer piping systems for hot and cold water installations inside buildings - Part 1: General
Edition 2008-07

Multilayer piping systems for hot and cold water installations inside buildings - Part 2: Pipes
Edition 2008-07

Materials for printed boards and other interconnecting structures - Part 4-16 : sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Edition 2014-02-01

Materials for printed boards and other interconnecting structures - Part 4-19 : sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance, non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Edition 2014-03-19

Integrated services digital network (ISDN) - Narrowband multi-service delivery system (NMDS) - Part 6: abstract test suite (ATS) and partial protocol implementation extra information for testing (PIXIT) specification for the NMDS layer 2 PSTN-GW function (NTN side) (V1.1.1)
Edition 2014-03-19

Broadband integrated services digital network (B-ISDN) - Digital subscriber signalling system No. two (DSS2) protocol - B-ISDN user-network interface layer 3 specification for basic call/bearer control - Part 2: protocol implementation conformance statement (PICS) proforma specification (V1.3.1)
Edition 2014-12-19

Wearable electronic devices and technologies - Part 801-1: Smart body area network (SmartBAN) - Enhanced ultra-low power physical layer (( IEC 63203-801-1:2022) EN IEC 63203-801-1:2022) (german version)
Edition 2023-11-01

Specifications for particular types of winding wires - Part 80: Polyvinyl acetal enamelled rectangular copper wire, class 120, with a bonding layer ((IEC 60317-80:2019) EN IEC 60317-80:2019) (german version)
Edition 2022-09-01

Waveguide type dielectric resonators - Part 1-5: General information and test conditions - Measurement method of conductivity at interface between conductor layer and dielectric substrate at microwave frequency (IEC 61338-1-5:2015) (german version)
Edition 2016-05-01

VHF air-ground and air-air Digital Link (VDL)Mode 4 radio equipment - Technical characteristics and methods of measurement for aeronautical mobile (airborne) equipment - Part 2: general description and data link layer (V1.4.1)
Edition 2015-09-19