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DIN EN IEC 61020-1
Electromechanical switches for use in electrical and electronic equipment - Part 1: Generic specification (IEC 61020-1:2019); German version EN IEC 61020-1:2019
Edition
2020-03
DIN EN 140402-801
Detail specification: Fixed low power wirewound surface mount (SMD) resistors - Rectangular - Stability classes 0,5; 1; 2; German version EN 140402-801:2015
Edition
2015-12
DIN EN IEC 60749-20-1
Semiconductor devices - Mechanical and climatic test methods - Part 20-1: Handling, packing, labelling and shipping of surface-mount devices sensitive to the combined effect of moisture and soldering heat (IEC 47/2488/CDV:2018); German and English version prEN IEC 60749-20-1:2018
Edition
2018-11
DIN EN IEC 62148-15
Fibre optic active components and devices - Package and interface standards - Part 15: Discrete vertical cavity surface emitting laser packages (IEC 62148-15:2021); German version EN IEC 62148-15:2021
Edition
2022-10
DIN EN 60191-6-8
Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for glass sealed ceramic quad flatpack (G-QFP) (IEC 60191-6-8:2001); German version EN 60191-6-8:2001
Edition
2002-05
DIN 41715-3
Electrical communication engineering; connectors, telecommunication adapter equipment (TAE); types A, B, C and R
Edition
1991-05
DIN EN IEC 63093-6
Ferrite cores - Guidelines on dimensions and the limits of surface irregularities - Part 6: ETD-cores for use in power supplies (IEC 63093-6:2018); German version EN IEC 63093-6:2018
Edition
2019-04
DIN EN 62575-2
Radio frequency (RF) bulk acoustic wave (BAW) filters of assessed quality - Part 2: Guidelines for the use (IEC 62575-2:2012); German version EN 62575-2:2012
Edition
2013-05
DIN EN IEC 61754-7-2
Fibre optic interconnecting devices and passive components - Fibre optic connector interfaces - Part 7-2: Type MPO connector family - Two fibre rows (IEC 61754-7-2:2017); German version EN IEC 61754-7-2:2018
Edition
2019-01
DIN EN 62137-4
Electronics assembly technology - Part 4: Endurance test methods for solder joint of area array type package surface mount devices (IEC 62137-4:2014); German version EN 62137-4:2014 + AC:2015
Edition
2015-07