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DIN EN 61189-3-719
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling (IEC 61189-3-719:2016); German version EN 61189-3-719:2016
Edition
2016-12
DIN EN 61754-1
Fibre optic interconnecting devices and passive components - Fibre optic connector interfaces - Part 1: General and guidance (IEC 61754-1:2013); German version EN 61754-1:2013
Edition
2014-05
DIN EN 61300-3-50
Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 3-50: Examinations and measurements - Crosstalk for optical spatial switches (IEC 61300-3-50:2013); German version EN 61300-3-50:2013
Edition
2014-02
DIN EN 61747-2-1
Liquid crystal display devices - Part 2-1: Passive matrix monochrome LCD modules - Blank detail specification (IEC 61747-2-1:2013); German version EN 61747-2-1:2013
Edition
2014-02
DIN EN 60286-4
Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms (IEC 60286-4:2013); German version EN 60286-4:2013
Edition
2014-04
DIN EN 61300-2-7
Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 2-7: Tests - Bending moment (IEC 61300-2-7:2013); German version EN 61300-2-7:2013
Edition
2014-03
DIN EN 61189-11
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys (IEC 61189-11:2013); German version EN 61189-11:2013
Edition
2014-02
DIN EN 61754-30
Fibre optic interconnecting devices and passive components - Fibre optic connector interfaces - Part 30: Type CLIK connector series (IEC 61754-30:2014); German version EN 61754-30:2014
Edition
2014-12
DIN EN 60317-52
Specifications for particular types of winding wires - Part 52: Aromatic polyamide (aramid) tape wrapped round copper wire, temperature index 220 (IEC 60317-52:2014); German version EN 60317-52:2014
Edition
2014-12
DIN EN 62047-22
Semiconductor devices - Micro-electromechanical devices - Part 22: Electromechanical tensile test method for conductive thin films on flexible substrates (IEC 62047-22:2014); German version EN 62047-22:2014
Edition
2015-04