Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (IEC 60749-15:2020); German version EN IEC 60749-15:2020
Edition 2022-05

Plasma display panels - Part 3-1: Mechanical interface (IEC 61988-3-1:2005); German version EN 61988-3-1:2005
Edition 2006-05

General lighting - Light emitting diode (LED) products and related equipment - Terms and definitions (IEC 62504:2014 + A1:2018); German version EN 62504:2014 + A1:2018
Edition 2018-11

Waveguide type dielectric resonators - Part 2: Guidelines for oscillator and filter applications (IEC 61338-2:2004); German version EN 61338-2:2004
Edition 2005-02

Organic light emitting diode (OLED) displays - Part 5-2: Mechanical endurance testing methods (IEC 62341-5-2:2013); German version EN 62341-5-2:2013
Edition 2015-01

Rack and panel connectors, trapezoidal, round contacts ∅ 1 mm; ratings, requirements, tests
Edition 1990-06

Packaging of components for automatic handling - Part 2: Tape packaging of components with unidirectional leads on continuous tapes (IEC 60286-2:2022); German version EN IEC 60286-2:2022
Edition 2023-11

Method for the determination of the space required by capacitors and resistors with unidirectional terminations (IEC 60717:2012); German version EN 60717:2012
Edition 2012-12

Mechanical standardization of semiconductor devices - Part 6: General rules for the preparation of outline drawings of surface mounted semiconductor device packages (IEC 60191-6:2009); German version EN 60191-6:2009
Edition 2010-06

Ferrite cores - Guidelines on dimensions and the limits of surface irregularities - Part 10: PM-cores and associated parts (IEC 63093-10:2022); German version EN IEC 63093-10:2022
Edition 2023-09