Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top-type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA) (IEC 60191-6-13:2016); German version EN 60191-6-13:2016
Edition 2017-06

High frequency inductive components - Electrical characteristics and measuring methods - Part 1: Nanohenry range chip inductor (IEC 51/1441/CDV:2023); German and English version prEN IEC 62024-1:2023
Edition 2023-10

Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST) (IEC 60749-4:2017); German version EN 60749-4:2017
Edition 2017-11

Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (IEC 61190-1-3:2017); German version EN IEC 61190-1-3:2018
Edition 2018-09

Connectors for electronic equipment - Product requirements - Part 1: Generic specification (IEC 61076-1:2006 + A1:2019); German version EN 61076-1:2006 + A1:2019
Edition 2019-10

Detail specification: Fixed low power film SMD resistors - Rectangular - Stability classes 1; 2; German version EN 140401-802:2007 + A1:2010 + A2:2013 + A3:2017
Edition 2017-09

Detail specification: Fixed low power film SMD resistors - Rectangular - Stability classes 0,1; 0,25; 0,5; 1; German version EN 140401-801:2007 + A1:2013
Edition 2014-09

Detail Specification: Fixed low power film high stability SMD resistors - Rectangular - Stability classes 0,1; 0,25; German version EN 140401-804:2011 + A1:2013 + A2:2019
Edition 2019-11

Electrical communication engineering; connectors, telecommunication adapter equipment (TAE); dimensions of types D, E, F and S
Edition 1991-05

Electrical communication engineering; connectors, telecommunication adapter equipment (TAE); dimensions of types G, H and T
Edition 1991-05