Materials for printed boards and other interconnecting structures. Sectional specification set for prepreg materials unclad (for the manufacture of multilayer boards). High performance epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Edition 2014-02-28

Space product assurance - Design, selection, procurement and use of die form monolithic microwave integrated circuits (MMICs)
Edition 2014-11-01

Nuclear power plants. Instrumentation and control important to safety. Development of HDL-programmed integrated circuits for systems performing category A functions
Edition 2013-01-31

Materials for printed boards and other interconnecting structures. Reinforced base materials clad and unclad. High performance, non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Edition 2013-04-30

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
Edition 2013-04-30

Semiconductor die products. Exchange data formats
Edition 2011-07-31

Semiconductor devices. Mechanical and climatic test methods. Board level drop test method using a strain gauge
Edition 2011-09-30

Semiconductor devices - Mechanical and climatic test methods Part 27: Electrostatic discharge (ESD) sensitivity testing - Machine Model (MM)
Edition 2011-02-28

Semiconductor devices - Mechanical and climatic test methods Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)
Edition 2011-02-28

Organic light emitting diode (OLED) displays. Environmental testing methods
Edition 2010-02-28