Specifications for particular types of winding wires - Part 42: Polyester-amide-imide enamelled round copper wire, class 200 (IEC 60317-42:1997 + A1:2010); German version EN 60317-42:1997 + A1:2010
Edition 2010-12

Fibre optic interconnecting devices and passive components - Fibre optic connector interfaces - Part 24-21: Type SC-RJ connectors with protective housings based on IEC 61076-3-106, variant 06 (IEC 61754-24-21:2009); German version EN 61754-24-21:2009
Edition 2010-04

Digital audio - Interface for non-linear PCM encoded audio bitstreams applying IEC 60958 - Part 9: Non-linear PCM bitstreams according to the MAT format (IEC 61937-9:2007); German version EN 61937-9:2007
Edition 2008-02

Helical-scan video tape cassette system using 12,65 mm (0,5 in) magnetic tape on type VHS - Part 2: FM audio recording (IEC 60774-2:1999); German version EN 60774-2:2000
Edition 2000-10

Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 2-40: Tests; Screen testing of attenuation of single-mode tuned angled optical connectors (IEC 61300-2-40:2000); German version EN 61300-2-40:2000
Edition 2001-10

Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Measuring methods for package dimensions of quat flat packs (QFP) (IEC 60191-6-3:2000); German version EN 60191-6-3:2000
Edition 2001-06

Packaging of winding wires - Part 5-2: Cylindrical barelled delivery spools with conical flanges; Specification for returnable spools made from thermoplastic material (IEC 60264-5-2:2001); German version EN 60264-5-2:2001
Edition 2002-03

Connectors for electronic equipment - Tests and measurements - Part 25-4: Test 25d: Propagation delay (IEC 60512-25-4:2001); German version EN 60512-25-4:2001
Edition 2002-08

Fibre optic connector interfaces - Part 19: Type SG connector family (IEC 61754-19:2001); German version EN 61754-19:2002
Edition 2002-11

Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA) (IEC 60191-6-4:2003); German version EN 60191-6-4:2003
Edition 2004-01