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Standards [CURRENT]

IPC DR-570A

General Specification for 1/8 inch Diameter Shank Carbide Drills for Printed Boards
Edition 1994-04-01

Standards [CURRENT]

IPC DR-572A

Drilling Guidelines for Printed Boards
Edition 2007-04-04

Standards [CURRENT]

IPC DW-425A

Design and End Product Requirements for Discrete Wiring Boards
Edition 1990-05

Standards [CURRENT]

IPC FC-234A

Pressure Sensitive Adhesive (PSA) Assembly Guidelines for Flexible, Rigid or Rigid-Flex Printed Boards
Edition 2014-12-23

Standards [CURRENT]

IPC HDBK-850

Guidelines for Design, Selection and Application of Potting Materials and Encapsulation Processes Used for Electronics Printed Circuit Board Assembly
Edition 2012-07-31

Standards [CURRENT]

IPC J-STD-003D

Solderability Tests for Printed Boards
Edition 2022-10-01

Standards [CURRENT]

IPC J-STD-030A

Selection and Application of Board Level Underfill Materials
Edition 2014-03-24

Standards [CURRENT]

IPC JEDEC 9702

Monotonic Bend Characterization of Board-Level Interconnects
Edition 2015-05

Standards [CURRENT]

IPC JEDEC 9707

Spherical Bend Test Method for Characterization of Board Level Interconnects
Edition 2011-09-13

Standards [CURRENT]

IPC JEDEC 9707 AMD 1

Spherical Bend Test Method for Characterization of Board Level Interconnects
Edition 2018-05-01

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