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SN EN IEC 61188-6-2
Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)
Edition
2021-03
EIA-364-61A
TP-61A Resistance to Soldering Heat from Rework Test Procedure for Electrical Connectors and Sockets Mounted on Printed Circuit Boards
Edition
2014-05
BS EN 62496-1
Optical circuit boards - General
Edition
2009-07-31
DIN EN IEC 61189-2-720
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-720: Detection of defects in interconnection structures by measurement of capacitance (IEC 91/1786/CD:2022); Text in German and English
Edition
2022-09
DIN EN IEC 61189-2-808
Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of dielectric layer by thermal transient method (IEC 91/1690/CD:2020); Text in German and English
Edition
2022-03
BS EN 62496-2-2
Optical circuit boards. Measurements. Dimensions of optical circuit boards
Edition
2011-06-30
OVE EN IEC 61188-6-1
Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards (german version)
Edition
2022-10-01
NF C62-921
Mains equipment and similar apparatus. Back-up fuse-link in connection with control board circuit-breaker
Edition
1981-12-01
DIN EN 60115-2
Fixed resistors for use in electronic equipment - Part 2: Sectional specification: Leaded fixed low power film resistors (IEC 40/2690/CD:2019); Text in German and English
Edition
2020-03
NF C93-930-1 ; NF EN 62496-1:2009-08-01
Optical circuit boards - Part 1: general
Edition
2009-08-01