Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD)
Edition 2021-03

TP-61A Resistance to Soldering Heat from Rework Test Procedure for Electrical Connectors and Sockets Mounted on Printed Circuit Boards
Edition 2014-05

Optical circuit boards - General
Edition 2009-07-31

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-720: Detection of defects in interconnection structures by measurement of capacitance (IEC 91/1786/CD:2022); Text in German and English
Edition 2022-09

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-808: Thermal resistance of dielectric layer by thermal transient method (IEC 91/1690/CD:2020); Text in German and English
Edition 2022-03

Optical circuit boards. Measurements. Dimensions of optical circuit boards
Edition 2011-06-30

Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards (german version)
Edition 2022-10-01

Mains equipment and similar apparatus. Back-up fuse-link in connection with control board circuit-breaker
Edition 1981-12-01

Fixed resistors for use in electronic equipment - Part 2: Sectional specification: Leaded fixed low power film resistors (IEC 40/2690/CD:2019); Text in German and English
Edition 2020-03

Optical circuit boards - Part 1: general
Edition 2009-08-01