Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for glass sealed ceramic quad flatpack (G-QFP) (IEC 60191-6-8:2001); German version EN 60191-6-8:2001
Edition 2002-05

Communication cables - Part 1-1: General; German version EN 50290-1-1:2001
Edition 2002-04

Connectors for electronic equipment - Tests and measurements - Part 25-4: Test 25d: Propagation delay (IEC 60512-25-4:2001); German version EN 60512-25-4:2001
Edition 2002-08

Connectors for electronic equipment - Tests and measurements - Part 25-3: Test 25c: Rise time degradation (IEC 60512-25-3:2001); German version EN 60512-25-3:2001
Edition 2002-08

Basic principles for graphical symbols for use on equipment - Part 2: Form and use of arrows (ISO 80416-2:2001); German version EN 80416-2:2001
Edition 2002-05

Communication cables - Specifications for test methods - Part 1-10: Electrical test methods; Crosstalk; German version EN 50289-1-10:2001
Edition 2002-07

Mechanical standardization of semiconductor devices - Part 6-2: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for 1,50 mm, 1,27 mm and 1,00 mm pitch ball and column terminal packages (IEC 60191-6-2:2001); German version EN 60191-6-2:2002
Edition 2002-09

Fibre optic connector interfaces - Part 18: Type MT-RJ connector family (IEC 61754-18:2001); German version EN 61754-18:2002
Edition 2002-09

Fibre optic connector interfaces - Part 19: Type SG connector family (IEC 61754-19:2001); German version EN 61754-19:2002
Edition 2002-11

Connectors for electronic equipment - Tests and measurements - Part 5-2: Current-carrying capacity tests; Test 5b: Current-temperature derating (IEC 60512-5-2:2002); German version EN 60512-5-2:2002
Edition 2003-01