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DIN EN 60512-14-2
Connectors for electronic equipment - Tests and measurements - Part 14-2: Sealing tests - Test 14b: Sealing - Fine air leakage (IEC 60512-14-2:2006); German version EN 60512-14-2:2006
Edition
2006-11
DIN EN 60512-14-5
Connectors for electronic equipment - Tests and measurements - Part 14-5: Sealing tests - Test 14e: Immersion at low air pressure (IEC 60512-14-5:2006); German version EN 60512-14-5:2006
Edition
2006-11
DIN EN 62343-3-1
Dynamic modules - Part 3-1: Performance specification templates - Dynamic channel equalizers (IEC 62343-3-1:2016); German version EN 62343-3-1:2016
Edition
2017-07
DIN EN 61755-3-1
Fibre optic connector optical interfaces - Part 3-1: Optical interface, 2,5 mm and 1,25 mm diameter cylindrical full zirconia PC ferrule, single mode fibre (IEC 61755-3-1:2006, modified + Corrigendum 2009); German version EN 61755-3-1:2009
Edition
2009-08
DIN EN 62453-303-2/A1
Field device tool (FDT) interface specification - Part 303-2: Communication profile integration - IEC 61784 CP 3/4, CP 3/5 and CP3/6 (IEC 62453-303-2:2009/A1:2016); English version EN 62453-303-2:2009/A1:2017
Edition
2018-05
DIN EN 62439-4/A1
Industrial communication networks - High availability automation networks - Part 4: Cross-network Redundancy Protocol (CRP) (IEC 62439-4:2010/A1:2012); English version EN 62439-4:2010/A1:2012
Edition
2013-06
DIN EN 61966-12-2
Multimedia systems and equipment - Colour measurement and management - Part 12-2: Simple metadata format for identification of colour gamut (IEC 61966-12-2:2014); German version EN 61966-12-2:2014
Edition
2016-09
DIN EN 62047-11
Semiconductor devices - Micro-electromechanical devices - Part 11: Test method for coefficients of linear thermal expansion of free-standing materials for micro-electromechanical systems (IEC 62047-11:2013); German version EN 62047-11:2013
Edition
2014-04
DIN EN 62047-6
Semiconductor devices - Micro-electromechanical devices - Part 6: Axial fatigue testing methods of thin film materials (IEC 62047-6:2009); German version EN 62047-6:2010
Edition
2010-07
DIN EN 62047-2
Semiconductor devices - Micro-electromechanical devices - Part 2: Tensile testing method of thin film materials (IEC 62047-2:2006); German version EN 62047-2:2006
Edition
2007-02
