Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering (IEC 61760-3:2021); German version EN IEC 61760-3:2021
Edition 2022-07

Semiconductor devices - Part 16-6: Microwave integrated circuits - Frequency multipliers (IEC 60747-16-6:2019); German version EN IEC 60747-16-6:2019
Edition 2021-08

Filters using waveguide type dielectric resonators - Part 2: Guidance for use (IEC 61337-2:2004); German version EN 61337-2:2004
Edition 2005-03

Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (IEC 61190-1-2:2014); German version EN 61190-1-2:2014
Edition 2014-11

Environmental testing - Part 2: Tests; test L: Dust and sand (IEC 60068-2-68:1994); German version EN 60068-2-68:1996
Edition 1997-02

Angular steel tanks for above ground storage of liquids with a flashpoint of more than 55 °C - Part 1: Principles for installation and test
Edition 2013-06

Semiconductor devices - Part 16-5: Microwave integrated circuits - Oscillators (IEC 60747-16-5:2013 + A1:2020 + COR1:2020); German version EN 60747-16-5:2013 + A1:2020
Edition 2021-08

Solderless connections - Part 5: Press-in connections - General requirements, test methods and practical guidance (IEC 60352-5:2020); German version EN IEC 60352-5:2020
Edition 2022-07

Fixed capacitors for use in electronic equipment - Part 21: Sectional specification - Fixed surface mount multilayer capacitors of ceramic dielectric, Class 1 (IEC 60384-21:2019); German version EN IEC 60384-21:2019
Edition 2019-09

Low resistance measurements - Methods and guidance (IEC 62812:2019); German version EN IEC 62812:2019
Edition 2020-04