Semiconductor devices - Micro-electromechanical devices - Part 12: Bending fatigue testing method of thin film materials using resonant vibration of MEMS structures (IEC 62047-12:2011); German version EN 62047-12:2011
Edition 2012-06

Integrated circuits - Measurement of electromagnetic emissions, 150 kHz to 1 GHz - Part 6: Measurement of conducted emissions - Magnetic probe method (IEC 61967-6:2002 + A1:2008); German version EN 61967-6:2002 + A1:2008
Edition 2008-10

Electroacoustics - Audiometric equipment - Part 5: Instruments for the measurement of aural acoustic impedance/admittance (IEC 60645-5:2004); German version EN 60645-5:2005
Edition 2005-08

Methods of measurement on radio receivers for various classes of emission - Part 6: General purpose communication receivers (IEC 60315-6:1991 + Corr.:1997)
Edition 1999-01

Potentiometers for use in electronic equipment - Part 3: Sectional specification: Rotary precision potentiometers (IEC 60393-3:2023); German version EN IEC 60393-3:2023
Edition 2024-10

Sound system equipment - Part 16: Objective rating of speech intelligibility by speech transmission index (IEC 60268-16:2020); German version EN IEC 60268-16:2020
Edition 2021-10

Semiconductor devices - Mechanical and climatic test methods - Part 20: Resistance of plastic encapsulated SMDs to the combined effect of moisture and soldering heat (IEC 60749-20:2020); German version EN IEC 60749-20:2020
Edition 2023-07

Reference conditions and procedures for testing industrial and process measurement transmitters - Part 4: Specific procedures for level transmitters (IEC 62828-4:2020); German version EN IEC 62828-4:2020
Edition 2022-07

Characterization of solids - Sampling of solid and semi-solid materials - Part 1: Guidance for the segmental sampling of stockpiles of unknown composite
Edition 2014-05

Process management for avionics - Counterfeit prevention - Part 2: Managing electronic components from non-franchised sources (IEC 62668-2:2019); German version EN IEC 62668-2:2019
Edition 2021-04