BASE MATERIALS FOR PRINTED CIRCUITS. PART 2: SPECIFICATIONS. SPECIFICATION no.4: EPOXIDE WOVEN GLASS FABRIC COPPER-CLAD LAMINATED SHEET, GENERAL PURPOSE GRADE.
Edition 1996-11-07

Base materials for printed circuits - Part 2: Specifications - Specification No. 1: Phenolic cellulose paper copper-clad laminated sheet, high electrical quality.
Edition 2001-02-22

Base materials for printed circuits - Part 2: Specifications - Specification No. 6: Phenolic cellulose paper copper-clad laminated sheet of defined flammability (horizontal burning test).
Edition 2001-10-30

Base materials for printed circuits - Part 2: Specifications - Specification No. 7: Phenolic cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test).
Edition 2001-10-30

Base materials for printed circuits - Part 2: Specifications - Specification No. 9: Epoxide cellulose paper core, epoxide glass cloth surfaces copper-clad laminated sheet of defined flammability (vertical burning test).
Edition 2001-10-30

Base materials for printed circuits - Part 2: Specifications - Specification No. 10: Epoxide non-woven/woven glass reinforced copper-clad laminated sheet of defined flammability (vertical burning test).
Edition 2001-10-30

Base materials for printed circuits. Part 2: Specifications. Specification no. 2: Phenolic cellulose paper copper-clad laminated sheet, econominc quality.
Edition 2001-03-29

Base materials for printed circuits - Part 2: Specifications - Specification No. 3: Epoxide cellulose paper copper-clad laminated sheet of defined flammability (vertical burning test).
Edition 2001-04-18

Base materials for printed circuits - Part 2: Specifications - Specification No. 11: Thin epoxide woven glass fabric copper-clad laminated sheet, general purpose grade, for use in the fabrication of multilayer printed boards.
Edition 2001-12-31

Base materials for printed circuits - Part 2-12: Specifications: thin epoxide woven glass fabric copper-clad laminated sheet of defined flammability, for use in the fabrication of multilayer printed boards.
Edition 2001-12-31