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SN EN 60191-6-20
Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)
Edition
2010-10
SN EN 60191-6-16
Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
Edition
2007-06
SN EN 60749-23
Semiconductor devices - Mechanical and climatic test methods. Part 23: High temperature operating life
Edition
2004-04
SN EN 60749-14
Semiconductor devices - Mechanical and climatic test methods. Part 14: Robustness of terminations (lead integrity)
Edition
2003-10
SN EN 60191-6-4
Mechanical standardization of semiconductor devices. Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
Edition
2003-07
SN EN 60749-25
Semiconductor devices - Mechanical and climatic test methods. Part 25: Temperature cycling
Edition
2003-09
SN EN IEC 63044-3
Home and Building Electronic Systems (HBES) and Building Automation and Control Systems (BACS) - Part 3: Electrical safety requirements
Edition
2018-01
Finite Elemente in der Baustatik-Praxis
Mit vielen Anwendungsbeispielen
Edition
2013-10
Barrierereduzierung im Bestand
Handbuch für Immobilienunternehmen
Edition
2015-08
Lösungen zur praktischen Umsetzung - Textbeispiele, Musterformulare, Checklisten
Edition
2020-04