Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)
Edition 2010-10

Mechanical standardization of semiconductor devices - Part 6-16: Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
Edition 2007-06

Semiconductor devices - Mechanical and climatic test methods. Part 23: High temperature operating life
Edition 2004-04

Semiconductor devices - Mechanical and climatic test methods. Part 14: Robustness of terminations (lead integrity)
Edition 2003-10

Mechanical standardization of semiconductor devices. Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
Edition 2003-07

Semiconductor devices - Mechanical and climatic test methods. Part 25: Temperature cycling
Edition 2003-09

Home and Building Electronic Systems (HBES) and Building Automation and Control Systems (BACS) - Part 3: Electrical safety requirements
Edition 2018-01