Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)
Edition 2016-11

Semiconductor devices - Semiconductor interface for human body communication - Part 3: Functional type and its operational conditions
Edition 2016-06

Semiconductor devices - Semiconductor interface for human body communication - Part 2: Characterization of interfacing performances
Edition 2016-05

Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage
Edition 2014-10

Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (P-PFBGA and P-PFLGA)
Edition 2011-04

Semiconductor die products - Part 2: Exchange data formats
Edition 2011-07

Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA)
Edition 2011-08

Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
Edition 2011-08

Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases
Edition 2011-09

Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
Edition 2010-10