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SN EN 60191-6-13
Mechanical standardization of semiconductor devices - Part 6-13: Design guideline of open-top type sockets for Fine-pitch Ball Grid Array (FBGA) and Fine-pitch Land Grid Array (FLGA)
Edition
2016-11
SN EN 62779-3
Semiconductor devices - Semiconductor interface for human body communication - Part 3: Functional type and its operational conditions
Edition
2016-06
SN EN 62779-2
Semiconductor devices - Semiconductor interface for human body communication - Part 2: Characterization of interfacing performances
Edition
2016-05
SN EN 60749-42
Semiconductor devices - Mechanical and climatic test methods - Part 42: Temperature and humidity storage
Edition
2014-10
SN EN 60191-6-17
Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (P-PFBGA and P-PFLGA)
Edition
2011-04
SN EN 62258-2
Semiconductor die products - Part 2: Exchange data formats
Edition
2011-07
SN EN 60191-6-12
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA)
Edition
2011-08
SN EN 60749-21
Semiconductor devices - Mechanical and climatic test methods - Part 21: Solderability
Edition
2011-08
SN EN 60749-7
Semiconductor devices - Mechanical and climatic test methods - Part 7: Internal moisture content measurement and the analysis of other residual gases
Edition
2011-09
SN EN 60191-6-21
Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
Edition
2010-10