Metallic and other inorganic coatings. Simultaneous thickness and electrode potential determination of individual layers in multilayer nickel deposits (STEP test)
Edition 2020-10-07

Plain bearings. Metallic multilayer plain bearings. Non-destructive ultrasonic testing of bond of thickness greater than or equal to 0,5 mm
Edition 2019-05-03

Plain bearings. Metallic multilayer plain bearings. Destructive testing of bond for bearing metal layer thicknesses greater than or equal to 2 mm
Edition 2019-04-24

System of quality assessment - Capability detail specification - Flex-rigid multilayer printed boards with through-connections
Edition 2001-12-17

Copper and copper alloys - Plumbing fittings - Part 6: Push-fit fittings for use with metallic tubes, plastics and multilayer pipes
Edition 2022-01-19

Metallic and other inorganic coatings - Simultaneous thickness and electrode potential determination of individual layers in multilayer nickel deposits (STEP test) (ISO 16866:2020)
Edition 2023-11-29

Multilayer (Monolithic), Unencapsulated, Ceramic Dielectric, Surface-Mount Low Inductance Chip Capacitors and Multi-Terminal Low Inductance Capacitors
Edition 2022-08

Fixed capacitors for use in electronic equipment - Part 21: Sectional specification - Fixed surface mount multilayer capacitors of ceramic dielectric, Class 1 (IEC 40/3055/CDV) (english version)
Edition 2023-08-01

Fixed capacitors for use in electronic equipment - Part 22: Sectional specification - Fixed surface mount multilayer capacitors of ceramic dielectric, Class 2 (IEC 40/3056/CDV) (english version)
Edition 2023-08-01

Base materials for printed circuits - Thin bismaleimide/triazine modified epoxide woven glass fabric copper-clad laminated sheet of defined flammability for use in the fabrication of multilayer printed boards
Edition 2000-02-29