Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (IEC 91/1043/CDV) (Amendment)
Edition 2012-07-15

Aerospace series - Nickel base alloy NI-B40002 - Filler metal for brazing- Powder or paste. (Endorsed by AENOR in December of 2001.)
Edition 2001-12-01

Aerospace series - Non-metallic materials - Structural adhesive systems - Paste adhesive - Technical specification (Endorsed by AENOR in March of 2013.)
Edition 2013-03-01

Semiconductor devices. Micro-electromechanical devices. Test method for adhesion strength of metal powder paste in MEMS interconnection
Edition 2021-07-07

Standard Guide for Measurement of the Rheological Properties of Hydraulic Cementious Paste Using a Rotational Rheometer
Edition 2017

Aerospace series - Gold base alloy AU-B40001 (AuNi18) - Filler metal for brazing - Powder or paste (Corrigendum of English version)
Edition 2003-10-01

Standard Practice for Preparing Prints of Paste Printing Inks Using a Hand Operated Laboratory Flat-Bed Press
Edition 2010

Standard Practice for Preparing Prints of Paste Printing Inks by a Motor-Driven Printability Tester
Edition 2010

Standard Test Method for Rheological Properties of Paste Printing and Vehicles by the Falling-Rod Viscometer
Edition 2010

Carbonaceous materials used in the production of aluminium - Cold and tepid ramming pastes - Preparation of baked test pieces and determination of loss on baking
Edition 2004-12-23