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DIN EN 61188-5-4
Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides (IEC 61188-5-4:2007); German version EN 61188-5-4:2007
Edition
2008-07
DIN EN 61188-5-8
Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA) (IEC 61188-5-8:2007); German version EN 61188-5-8:2008
Edition
2008-07
DIN EN 61188-5-2
Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components (IEC 61188-5-2:2003); German version EN 61188-5-2:2003
Edition
2004-05
DIN EN 61188-5-5
Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides (IEC 61188-5-5:2007); German version EN 61188-5-5:2007
Edition
2008-07
DIN EN 62610-4
Mechanical structures for electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 4: Cooling performance tests for water supplied heat exchangers in electronic cabinets (IEC 62610-4:2013); German version EN 62610-4:2013
Edition
2014-04
DIN EN 61188-5-3
Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides (IEC 61188-5-3:2007); German version EN 61188-5-3:2007
Edition
2008-07
DIN EN 61188-5-6
Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations; Chip carriers with J-leads on four sides (IEC 61188-5-6:2003); German version EN 61188-5-6:2003
Edition
2003-10
DIN EN 61587-2 ; VDE 0687-587-2:2012-06
Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 2: Seismic tests for cabinets and racks (IEC 61587-2:2011); German version EN 61587-2:2011
Edition
2012-06
DIN EN 60297-3-109 ; VDE 0687-297-3-109:2016-09
Mechanical structures for electrical and electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-109: Dimensions of chassis for embedded computing devices (IEC 60297-3-109:2015); German version EN 60297-3-109:2016
Edition
2016-09
DIN EN 61587-4 ; VDE 0687-587-4:2013-04
Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 series - Part 4: Combination of performance levels for modular cabinets (IEC 61587-4:2012); German version EN 61587-4:2012
Edition
2013-04