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Standards [CURRENT]

DIN EN 61188-5-4

Printed boards and printed board assemblies - Design and use - Part 5-4: Attachment (land/joint) considerations - Components with J leads on two sides (IEC 61188-5-4:2007); German version EN 61188-5-4:2007
Edition 2008-07

Standards [CURRENT]

DIN EN 61188-5-8

Printed boards and printed board assemblies - Design and use - Part 5-8: Attachment (land/joint) considerations - Area array components (BGA, FBGA, CGA, LGA) (IEC 61188-5-8:2007); German version EN 61188-5-8:2008
Edition 2008-07

Standards [CURRENT]

DIN EN 61188-5-2

Printed boards and printed board assemblies - Design and use - Part 5-2: Attachment (land/joint) considerations - Discrete components (IEC 61188-5-2:2003); German version EN 61188-5-2:2003
Edition 2004-05

Standards [CURRENT]

DIN EN 61188-5-5

Printed boards and printed board assemblies - Design and use - Part 5-5: Attachment (land/joint) considerations - Components with gull-wing leads on four sides (IEC 61188-5-5:2007); German version EN 61188-5-5:2007
Edition 2008-07

Standards [CURRENT]

DIN EN 62610-4

Mechanical structures for electronic equipment - Thermal management for cabinets in accordance with IEC 60297 and IEC 60917 series - Part 4: Cooling performance tests for water supplied heat exchangers in electronic cabinets (IEC 62610-4:2013); German version EN 62610-4:2013
Edition 2014-04

Standards [CURRENT]

DIN EN 61188-5-3

Printed boards and printed board assemblies - Design and use - Part 5-3: Attachment (land/joint) considerations - Components with gull-wing leads on two sides (IEC 61188-5-3:2007); German version EN 61188-5-3:2007
Edition 2008-07

Standards [CURRENT]

DIN EN 61188-5-6

Printed boards and printed board assemblies - Design and use - Part 5-6: Attachment (land/joint) considerations; Chip carriers with J-leads on four sides (IEC 61188-5-6:2003); German version EN 61188-5-6:2003
Edition 2003-10

Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 2: Seismic tests for cabinets and racks (IEC 61587-2:2011); German version EN 61587-2:2011
Edition 2012-06

Mechanical structures for electrical and electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-109: Dimensions of chassis for embedded computing devices (IEC 60297-3-109:2015); German version EN 60297-3-109:2016
Edition 2016-09

Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 series - Part 4: Combination of performance levels for modular cabinets (IEC 61587-4:2012); German version EN 61587-4:2012
Edition 2013-04

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