Device embedding assembly technology - Part 2-602: Guideline for stacked electronic module - Evaluation method of inter-module electrical connectivity (IEC 62878-2-602:2021); German version EN IEC 62878-2-602:2021
Edition 2022-08

Flanges for waveguides - Part 1: General requirements (IEC 60154-1:2016); German version EN 60154-1:2016
Edition 2017-02

Fibre optic interconnecting devices and passive components - Connector optical interfaces - Part 3-10: Connector parameters of non-dispersion shifted single mode physically contacting fibres - Non-angled, ferrule-less, bore alignment connectors (IEC 61755-3-10:2016); German version EN 61755-3-10:2017
Edition 2017-10

Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 3-25: Examinations and measurements - Concentricity of non-angled ferrules and non-angled ferrules with fibre installed (IEC 61300-3-25:2016); German version EN 61300-3-25:2016
Edition 2017-05

Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 2-47: Tests - Thermal shocks (IEC 61300-2-47:2016); German version EN 61300-2-47:2016
Edition 2017-06

Semiconductor devices - Mechanical and climatic test methods - Part 9: Permanence of marking (IEC 60749-9:2017); German version EN 60749-9:2017
Edition 2017-11

Specifications for particular types of winding wires - Part 67: Polyvinyl acetal enamelled rectangular aluminium wire, class 105 (IEC 60317-67:2017); German version EN 60317-67:2017
Edition 2017-11

Specifications for particular types of winding wires - Part 69: Polyester or polyesterimide overcoated with polyamide-imide enamelled rectangular aluminium wire, class 220 (IEC 60317-69:2017); German version EN 60317-69:2017
Edition 2017-11

Fibre optic interconnecting devices and passive components - Fibre optic connector interfaces - Part 4-100: Type SC connector family - Simplified receptacle SC-PC connector interfaces (IEC 61754-4-100:2015); German version EN 61754-4-100:2016
Edition 2016-09

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 2-807: Test methods for materials for interconnection structures - Decomposition temperature (Td) using TGA (IEC 61189-2-807:2021); German version EN IEC 61189-2-807:2021
Edition 2023-01