Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design ((IEC 61188-6-4:2019) EN IEC 61188-6-4:2019) (german version)
Edition 2020-05-01

Test methods for electrical materials, printed board and other interconnection structures and assemblies - Part 2-630: Test methods for materials for interconnection structures - Moisture absorption after pressure vessel conditioning ((IEC 61189-2-630:2018) EN IEC 61189-2-630:2018) (german version)
Edition 2019-04-01

Connectors for electronic equipment - Part 4-107: Printed board connectors with assessed quality - Detail specification for shielded two-part connectors having a basic grid of 2,0 mm, fixed part with solder and press-in terminations for printed boards, free part with non-accessible insulation displacement and crimp terminations (IEC 61076-4-107:2001)
Edition 2002-06-01

Connectors for use in d.c. low-frequency analogue and digital high speed data applications - Part 4-103: Printed board connectors with assessed quality - Detail specification for two-part connectors with shielding and a basic grid of 2,5 mm (IEC 61076-4-103:1999)
Edition 1999-11-01

Connectors for use in d.c., low-frequency analogue and digital high speed data applications - Part 4-104: Printed board connectors with assessed quality - Detail specification for two-part modular connectors, basic grid of 2,0 mm, with terminations on a multiple grid of 0,5 mm (IEC 61076-4-104:1999)
Edition 2000-01-01

Connectors for electronic equipment - Part 4-111: Printed board connectors with assessed quality - Detail specification for two-part power connector modules, for printed boards and backplanes having early mating features, and having a basic grid of 2,5 mm in accordance with IEC 60917-1 (IEC 61076-4-111:2002)
Edition 2003-04-01

Satellite Earth Stations and Systems (SES) - Harmonized EN for satellite Earth Stations on board Vessels (ESVs) operating in the 11/12/14 GHz frequency bands allocated to the Fixed Satellite Service (FSS) covering essential requirements under article 3.2 of the R&TTE directive (V1.1.1)
Edition 2006-09-01

Materials for printed boards and other interconnecting structures - Part 2-38: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Edition 2009-03

Materials for printed boards and other interconnecting structures - Part 2-37: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Edition 2009-03

Materials for printed boards and other interconnecting structures - Part 2-36: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Edition 2009-03