Mechanical Standardization Of Semiconductor Devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array andSili
Edition 2013-03

Hydraulic fluid power - Flange connections with split or one-piece flange clamps and metric or inch screws - Part 1: Flange connectors, ports and mounting surfaces for use at pressures of 3,5 MPa (35 bar) to 35 MPa (350 bar), DN 13 to DN 127
Edition 2012-12

Hydraulic fluid power - Flange connections with split or one-piece flange clamps and metric or inch screws - Part 2: Flange connectors, ports and mounting surfaces for use at a pressure of 42 MPa (420 bar), DN 13 to DN 76
Edition 2018-03

Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA)
Edition 2013-04-30

Mechanical standardization of semiconductor devices - Part 6-17 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)
Edition 2012-10-01

Mechanical standardization of semiconductor devices - Part 6-22 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (SFBGA and S-FLGA)
Edition 2013-09-14

Mechanical standardization of semiconductor devices - Part 6-17: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch Ball Grid Array and Fine-pitch Land Grid Array (P-PFBGA and P-PFLGA)
Edition 2011-04