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SN EN 60191-6-4
Mechanical standardization of semiconductor devices. Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
Edition
2003-07
EIA CB-11
Surface Mounting of Multilayer Ceramic Chip Capacitors, Guidelines for
Edition
1986
DIN CEN/TS 15213-6 ; DIN SPEC 91121:2011-09
Road transport and traffic telematics - After-theft services for the recovery of stolen vehicles - Part 6: Test procedures; English version CEN/TS 15213-6:2011
Edition
2011-09
BS ISO 6162-2
Hydraulic fluid power. Flange connections with split or one-piece flange clamps and metric or inch screws. Flange connectors, ports and mounting surfaces for use at a pressure of 42 MPa (420 bar), DN 13 to DN 76
Edition
2018-03-02
BS EN 60191-6-17
Mechanical standardization of semiconductor devices. General rules for the preparation of outline drawings of surface mounted semiconductor device packages. Design guide for stacked packages. Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)
Edition
2011-06-30
BS ISO 6162-1
Hydraulic fluid power. Flange connections with split or one-piece flange clamps and metric or inch screws. Flange connectors, ports and mounting surfaces for use at pressures of 3,5 MPa (35 bar) to 35 MPa (350 bar), DN 13 to DN 127
Edition
2012-12-31
NF E48-055-2 ; NF ISO 6162-2:2018-04-28
Hydraulic fluid power - Flange connections with split or one-piece flange clamps and metric or inch screws - Part 2: flange connectors, ports and mounting surfaces for use at a pressure of 42 MPa (420 bar), DN 13 to DN 76
Edition
2018-04-28
NF E48-055-1 ; NF ISO 6162-1:2013-06-22
Hydraulic fluid power - Flange connections with split or one-piece flange clamps and metric or inch screws - Part 1: flange connectors, ports and mounting surfaces for use at pressures of 3,5 MPa (35 bar) to 35 MPa (350 bar), DN 13 to DN 127
Edition
2013-06-22
NF C96-013-6-20 ; NF EN 60191-6-20:2011-05-01
Mechanical standardization of semiconductor devices - Part 6-20 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)
Edition
2011-05-01
SN EN 60191-6-20
Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)
Edition
2010-10
