Search results
Search list
Results in:
DIN EN ISO 13694
Optics and photonics - Lasers and laser-related equipment - Test methods for laser beam power (energy) density distribution (ISO 13694:2018); German version EN ISO 13694:2018
Edition
2019-06
DIN EN ISO 25178-71
Geometrical product specifications (GPS) - Surface texture: Areal - Part 71: Software measurement standards (ISO 25178-71:2017); German version EN ISO 25178-71:2017
Edition
2018-01
DIN EN 13231-5
Railway applications - Track - Acceptance of works - Part 5: Procedures for rail reprofiling in plain line, switches, crossings and expansion devices; German version EN 13231-5:2018
Edition
2018-08
DIN EN 16585-2
Railway applications - Design for PRM use - Equipment and components on board rolling stock - Part 2: Elements for sitting, standing and moving; German version EN 16585-2:2017
Edition
2017-05
DIN EN IEC 63073-1
Dedicated radionuclide imaging devices - Characteristics and test conditions - Part 1: Cardiac SPECT (IEC 63073-1:2020); German version EN IEC 63073-1:2020
Edition
2021-09
DIN EN ISO 27874
Metallic and other inorganic coatings - Electrodeposited gold and gold alloy coatings for electrical, electronic and engineering purposes - Specification and test methods (ISO 27874:2008); German version EN ISO 27874:2008
Edition
2009-01
DIN EN 1492-4
Textile slings - Safety - Part 4: Lifting slings for general service made from natural and man-made fibre ropes; German version EN 1492-4:2004+A1:2008
Edition
2009-02
DIN EN ISO 5577
Non-destructive testing - Ultrasonic testing - Vocabulary (ISO 5577:2017); German version EN ISO 5577:2017
Edition
2017-05
DIN EN 60191-6-12
Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA) (IEC 60191-6-12:2011); German version EN 60191-6-12:2011
Edition
2011-12
DIN EN IEC 62148-21
Fibre optic active components and devices - Package and interface standards - Part 21: Design guidelines of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA) (IEC 62148-21:2021); German version EN IEC 62148-21:2021
Edition
2022-09