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Standards [CURRENT]

DIN EN 62150-1

Fibre optic active components and devices - Test and measurement procedures - Part 1: General and guidance (IEC 62150-1:2005); German version EN 62150-1:2005
Edition 2005-12

Standards [CURRENT]

DIN EN 61754-23

Fibre optic connector interfaces - Part 23: Type LX.5 connector family (IEC 61754-23:2005); German version EN 61754-23:2005
Edition 2006-02

Standards [CURRENT]

DIN EN 60068-3-2

Environmental testing - Part 3: Background information; section 2: Combined temperature/low air pressure tests (IEC 60068-3-2:1976); German version EN 60068-3-2:1999
Edition 2000-02

Standards [CURRENT]

DIN EN 60512-6-5

Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 6: Dynamic stress tests; section 5: Test 6e: Random vibration (IEC 60512-6-5:1997, modified); German version EN 60512-6-5:1999
Edition 2000-10

Standards [CURRENT]

DIN EN 60512-20-2

Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 20-2: Test: 20b: Flammability tests; Fireproofness (IEC 60512-20-2:2000); German version EN 60512-20-2:2000
Edition 2001-04

Standards [CURRENT]

DIN EN 60191-6-3

Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Measuring methods for package dimensions of quat flat packs (QFP) (IEC 60191-6-3:2000); German version EN 60191-6-3:2000
Edition 2001-06

Standards [CURRENT]

DIN EN 60264-5-2

Packaging of winding wires - Part 5-2: Cylindrical barelled delivery spools with conical flanges; Specification for returnable spools made from thermoplastic material (IEC 60264-5-2:2001); German version EN 60264-5-2:2001
Edition 2002-03

Standards [CURRENT]

DIN EN 60191-6-8

Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for glass sealed ceramic quad flatpack (G-QFP) (IEC 60191-6-8:2001); German version EN 60191-6-8:2001
Edition 2002-05

Standards [CURRENT]

DIN EN 60191-6-5

Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine-pitch ball grid array (FBGA) (IEC 60191-6-5:2001); German version EN 60191-6-5:2001
Edition 2002-05

Standards [CURRENT]

DIN EN 50290-1-1

Communication cables - Part 1-1: General; German version EN 50290-1-1:2001
Edition 2002-04

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