Search results
Search list
Results in:
DIN EN 62150-1
Fibre optic active components and devices - Test and measurement procedures - Part 1: General and guidance (IEC 62150-1:2005); German version EN 62150-1:2005
Edition
2005-12
DIN EN 61754-23
Fibre optic connector interfaces - Part 23: Type LX.5 connector family (IEC 61754-23:2005); German version EN 61754-23:2005
Edition
2006-02
DIN EN 60068-3-2
Environmental testing - Part 3: Background information; section 2: Combined temperature/low air pressure tests (IEC 60068-3-2:1976); German version EN 60068-3-2:1999
Edition
2000-02
DIN EN 60512-6-5
Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 6: Dynamic stress tests; section 5: Test 6e: Random vibration (IEC 60512-6-5:1997, modified); German version EN 60512-6-5:1999
Edition
2000-10
DIN EN 60512-20-2
Electromechanical components for electronic equipment - Basic testing procedures and measuring methods - Part 20-2: Test: 20b: Flammability tests; Fireproofness (IEC 60512-20-2:2000); German version EN 60512-20-2:2000
Edition
2001-04
DIN EN 60191-6-3
Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Measuring methods for package dimensions of quat flat packs (QFP) (IEC 60191-6-3:2000); German version EN 60191-6-3:2000
Edition
2001-06
DIN EN 60264-5-2
Packaging of winding wires - Part 5-2: Cylindrical barelled delivery spools with conical flanges; Specification for returnable spools made from thermoplastic material (IEC 60264-5-2:2001); German version EN 60264-5-2:2001
Edition
2002-03
DIN EN 60191-6-8
Mechanical standardization of semiconductor devices - Part 6-8: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for glass sealed ceramic quad flatpack (G-QFP) (IEC 60191-6-8:2001); German version EN 60191-6-8:2001
Edition
2002-05
DIN EN 60191-6-5
Mechanical standardization of semiconductor devices - Part 6-5: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Design guide for fine-pitch ball grid array (FBGA) (IEC 60191-6-5:2001); German version EN 60191-6-5:2001
Edition
2002-05
DIN EN 50290-1-1
Communication cables - Part 1-1: General; German version EN 50290-1-1:2001
Edition
2002-04