Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (Endorsed by AENOR in February of 2011.)
Edition 2011-02-01

Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (Endorsed by AENOR in February of 2011.)
Edition 2011-02-01

Chemical analysis of magnesite and dolomite refractory products (alternative to the X-ray fluorescence method) - Part 1: Apparatus, reagents, dissolution and determination of gravimetric silica (ISO 10058-1:2008) (Endorsed by AENOR in February of 2009.)
Edition 2009-02-01

Chemical analysis of magnesite and dolomite refractory products (alternative to the X-ray fluorescence method) - Part 3: Flame atomic absorption spectrophotometry (FAAS) and inductively coupled plasma atomic emission spectrometry (ICP-AES) (ISO 10058-3:2008) (Endorsed by AENOR in February of 2009.)
Edition 2009-02-01

Chemical analysis of chrome-bearing refractory products and chrome-bearing raw materials (alternative to the X-ray fluorescence method) - Part 1: Apparatus, reagents, dissolution and determination of gravimetric silica (ISO 20565-1:2008) (Endorsed by AENOR in February of 2009.)
Edition 2009-02-01

Chemical analysis of chrome-bearing refractory products and chrome-bearing raw materials (alternative to the X-ray fluorescence method) - Part 2: Wet chemical analysis (ISO 20565-2:2008) (Endorsed by AENOR in February of 2009.)
Edition 2009-02-01

Connectors for electronic equipment - Tests and measurements - Part 26-100: Measurement setup, test and reference arrangements and measurements for connectors according to IEC 60603-7 - Tests 26a to 26g (Endorsed by AENOR in February of 2009.)
Edition 2009-02-01

Field device tool (FDT) interface specification - Part 303-2: Communication profile integration - IEC 61784 CP 3/4, CP 3/5 and CP 3/6 (Endorsed by AENOR in February of 2010.)
Edition 2010-02-01

Connectors for electrical and electronic equipment - Tests and measurements - Part 28-100: Signal integrity tests up to 2000 MHz - Tests 28a to 28g (Endorsed by Asociación Española de Normalización in February of 2020.)
Edition 2020-02-01

Cable networks for television signals, sound signals and interactive services - Part 2-4: Interference Mitigation Filters operating in the 700 MHz and 800 MHz bands for DTT reception (Endorsed by Asociación Española de Normalización in February of 2020.)
Edition 2020-02-01