Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 3-10: Examinations and measurements - Gauge retention force (IEC 61300-3-10:2006); German version EN 61300-3-10:2007
Edition 2007-10

Connectors for electronic equipment - Tests and measurements - Part 12-3: Soldering tests - Test 12c: Solderability, de-wetting (IEC 60512-12-3:2006); German version EN 60512-12-3:2006
Edition 2006-11

Connectors for electronic equipment - Tests and measurements - Part 12-5: Soldering tests - Test 12e: Resistance to soldering heat, soldering iron method (IEC 60512-12-5:2006); German version EN 60512-12-5:2006
Edition 2006-11

Packaging of winding wires - Part 1: Containers for round winding wires (IEC 60264-1:1968 + A1:2009); German version EN 60264-1:1994 + A1:2009
Edition 2010-02

Wireless Power Transfer - Management - Part 1: Common Components (IEC 62827-1:2016); German version EN 62827-1:2016
Edition 2017-05

Standardization - Part 2: Presentation of documents (ISO/IEC Directives - Part 2:2021, modified); German and English version CEN-CENELEC Internal Regulations - Part 3:2022
Edition 2022-12

Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 60191-6-20:2010); German version EN 60191-6-20:2010
Edition 2011-03

Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials (IEC 62047-18:2013); German version EN 62047-18:2013
Edition 2014-04

Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA) (IEC 60191-6-22:2012); German version EN 60191-6-22:2013
Edition 2013-08

Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 60191-6-21:2010); German version EN 60191-6-21:2010
Edition 2011-03