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DIN EN 61190-1-1
Attachment materials for electronic assembly - Part 1-1: Requirements for soldering fluxes for high-quality interconnections in electronics assembly (IEC 61190-1-1:2002); German version EN 61190-1-1:2002
Edition
2003-01
DIN EN 61190-1-2
Attachment materials for electronic assembly - Part 1-2: Requirements for soldering pastes for high-quality interconnects in electronics assembly (IEC 61190-1-2:2014); German version EN 61190-1-2:2014
Edition
2014-11
DIN EN IEC 61190-1-3
Attachment materials for electronic assembly - Part 1-3: Requirements for electronic grade solder alloys and fluxed and non-fluxed solid solder for electronic soldering applications (IEC 61190-1-3:2017); German version EN IEC 61190-1-3:2018
Edition
2018-09
DIN EN IEC 61191-1
Printed board assemblies - Part 1: Generic specification - Requirements for soldered electrical and electronic assemblies using surface mount and related assembly technologies (IEC 61191-1:2018); German version EN IEC 61191-1:2018
Edition
2019-06
DIN EN 61191-2
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (IEC 61191-2:2017); German version EN 61191-2:2017
Edition
2018-05
DIN EN 61191-2 Berichtigung 1
Printed board assemblies - Part 2: Sectional specification - Requirements for surface mount soldered assemblies (IEC 61191-2:2017/COR1:2019); German version EN 61191-2:2017/AC:2019
Edition
2020-02
DIN EN 61191-3
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies (IEC 61191-3:2017); German version EN 61191-3:2017
Edition
2018-05
DIN EN 61191-4
Printed board assemblies - Part 4: Sectional specification - Requirements for terminal soldered assemblies (IEC 61191-4:2017); German version EN 61191-4:2017
Edition
2018-05
DIN EN 61587-5 ; VDE 0687-587-5:2014-12
Mechanical structures for electronic equipment - Tests for IEC 60917 and IEC 60297 - Part 5: Seismic tests for chassis, subracks and plug-in units (IEC 61587-5:2013); German version EN 61587-5:2014
Edition
2014-12
DIN EN 62137-3
Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints (IEC 62137-3:2011); German version EN 62137-3:2012
Edition
2012-08
