Specification for Immersion Tin Plating for Printed Circuit Boards; Amendment 1
Edition 2012-01-09

Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD) (IEC 61188-6-2:2021); German version EN IEC 61188-6-2:2021
Edition 2023-03

Polyimide Printed Circuit Boards Fabrication of
Edition 2022-06-05

Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Circuit Boards
Edition 2016-01-01

Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards
Edition 2013-02-04

Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards (IEC 61188-6-1:2021); German version EN IEC 61188-6-1:2021
Edition 2022-08

CONNECTORS FOR FREQUENCIES BELOW 3 MHZ. PRINTED CIRCUIT BOARD MOUNTED CONNECTORS WITH TWO ROWS OF STAGGERED CONTACTS AND TERMINATIONS WITH SPACING OF 2,54 MM
Edition 1982-12-15

Space product assurance. Repair and modification of printed circuit board assemblies for space use
Edition 2014-11-30

Space product assurance - Repair and modification of printed circuit board assemblies for space use
Edition 2015-01

Space product assurance - Repair and modification of printed circuit board assemblies for space use
Edition 2015-02-15