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IPC 4554 AMD 1
Specification for Immersion Tin Plating for Printed Circuit Boards; Amendment 1
Edition
2012-01-09
DIN EN IEC 61188-6-2
Circuit boards and circuit board assemblies - Design and use - Part 6-2: Land pattern design - Description of land pattern for the most common surface mounted components (SMD) (IEC 61188-6-2:2021); German version EN IEC 61188-6-2:2021
Edition
2023-03
SAE ARP 1612A
Polyimide Printed Circuit Boards Fabrication of
Edition
2022-06-05
IPC 4556 AMD 1
Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Circuit Boards
Edition
2016-01-01
IPC 4556
Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards
Edition
2013-02-04
DIN EN IEC 61188-6-1
Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards (IEC 61188-6-1:2021); German version EN IEC 61188-6-1:2021
Edition
2022-08
UNE 20629-16
CONNECTORS FOR FREQUENCIES BELOW 3 MHZ. PRINTED CIRCUIT BOARD MOUNTED CONNECTORS WITH TWO ROWS OF STAGGERED CONTACTS AND TERMINATIONS WITH SPACING OF 2,54 MM
Edition
1982-12-15
BS EN 16602-70-28
Space product assurance. Repair and modification of printed circuit board assemblies for space use
Edition
2014-11-30
SN EN 16602-70-28
Space product assurance - Repair and modification of printed circuit board assemblies for space use
Edition
2015-01
OENORM EN 16602-70-28
Space product assurance - Repair and modification of printed circuit board assemblies for space use
Edition
2015-02-15