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DIN EN 61300-2-33
Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 2-33: Tests - Assembly and disassembly of fibre optic mechanical splices, fibre management systems and closures (IEC 61300-2-33:2012); German version EN 61300-2-33:2012
Edition
2013-02
DIN EN 60917-2-5
Modular order for the development of mechanical structures for electronic equipment practices - Part 2-5: Sectional specification - Interface co-ordination dimensions for the 25 mm equipment practice - Cabinet interface dimensions for miscellaneous equipment (IEC 60917-2-5:2012); German version EN 60917-2-5:2012
Edition
2013-04
DIN EN 60297-3-106
Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-106: Adaptation dimensions for subracks and chassis applicable with metric cabinets or racks in accordance with IEC 60917-2-1 (IEC 60297-3-106:2010); German version EN 60297-3-106:2010
Edition
2011-01
DIN EN 60317-44
Specifications for particular types of winding wires - Part 44: Aromatic polyimide tape wrapped rectangular copper wire, class 240 (IEC 60317-44:1997 + A1:2010); German version EN 60317-44:1997 + A1:2010
Edition
2011-01
DIN EN 61280-2-1
Fibre optic communication subsystem test procedures - Part 2-1: Digital systems - Receiver sensitivity and overload measurement (IEC 61280-2-1:2010); German version EN 61280-2-1:2010
Edition
2011-01
DIN EN 60191-6-20
Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 60191-6-20:2010); German version EN 60191-6-20:2010
Edition
2011-03
DIN EN 60191-6-21
Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 60191-6-21:2010); German version EN 60191-6-21:2010
Edition
2011-03
DIN EN 60749-23
Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life (IEC 60749-23:2004 + A1:2011); German version EN 60749-23:2004 + A1:2011
Edition
2011-07
DIN EN 62333-3
Noise suppression sheet for digital devices and equipment - Part 3: Characterization of parameters of noise suppression sheet (IEC 62333-3:2010); German version EN 62333-3:2010
Edition
2010-09
DIN EN 61300-3-34
Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 3-34: Examinations and measurements - Attenuation of random mated connectors (IEC 61300-3-34:2009); German version EN 61300-3-34:2009
Edition
2009-09