Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
Edition 2010-02

Detail specification: Fixed low power film SMD resistors - Cylindrical - Stability classes 0,05; 0,1; 0,25; 0,5; 1; 2
Edition 2010-10

Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP)
Edition 2010-10

Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ)
Edition 2010-10

Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch land grid array (FLGA)
Edition 2011-08

Connectors for electronic equipment - Part 7-1: Detail specification for 8-way, shielded, free and fixed connectors
Edition 2011-06

Electronics assembly technology - Part 3: Selection guidance of environmental and endurance test methods for solder joints
Edition 2012-01

Evaluation of a.c. corrosion likelihood of buried pipelines applicable to cathodically protected pipelines
Edition 2013-10

Mechanical structures for electronic equipment - Dimensions of mechanical structures of the 482,6 mm (19 in) series - Part 3-107: Dimensions of subracks and plug-in units, small form factor
Edition 2012-03

Commissioning of electrical, instrumentation and control systems in the process industry - Specific phases and milestones
Edition 2012-04