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Standards [CURRENT]

DIN EN 12952-5

Water-tube boilers and auxiliary installations - Part 5: Workmanship and construction of pressure parts of the boiler; German version EN 12952-5:2021
Edition 2022-02

Standards [CURRENT]

DIN EN 14276-1

Pressure equipment for refrigerating systems and heat pumps - Part 1: Vessels - General requirements; German version EN 14276-1:2020
Edition 2020-11

Standards [CURRENT]

DIN EN 13501-2

Fire classification of construction products and building elements - Part 2: Classification using data from fire resistance and/or smoke control tests, excluding ventilation services; German version EN 13501-2:2023
Edition 2023-12

Standards [CURRENT]

DIN EN 13121-3

GRP tanks and vessels for use above ground - Part 3: Design and workmanship; German version EN 13121-3:2016
Edition 2016-10

Standards [CURRENT]

DIN EN 10151

Stainless steel strip for springs - Technical delivery conditions; German version EN 10151:2002
Edition 2003-02

Draft standard

DIN EN ISO 21536

Non-active surgical implants - Joint replacement implants - Specific requirements for knee-joint replacement implants (ISO/DIS 21536:2021); German and English version prEN ISO 21536:2021
Edition 2021-08

Standards [CURRENT]

DIN EN 17020-5

Extended application of test results on durability of self-closing for fire resistance and/or smoke control doorsets and openable windows - Part 5: Durability of self-closing of hinged and pivoted timber doorsets; German version EN 17020-5:2023
Edition 2023-10

Standards [CURRENT]

DIN EN 1999-1-1

Eurocode 9: Design of aluminium structures - Part 1-1: General structural rules; German version EN 1999-1-1:2007 + A1:2009 + A2:2013
Edition 2014-03

Standards [CURRENT]

DIN EN 60317-67

Specifications for particular types of winding wires - Part 67: Polyvinyl acetal enamelled rectangular aluminium wire, class 105 (IEC 60317-67:2017); German version EN 60317-67:2017
Edition 2017-11

Standards [CURRENT]

DIN EN 60191-6-3

Mechanical standardization of semiconductor devices - Part 6-3: General rules for the preparation of outline drawings of surface mounted semiconductor device packages; Measuring methods for package dimensions of quat flat packs (QFP) (IEC 60191-6-3:2000); German version EN 60191-6-3:2000
Edition 2001-06

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