Materials for printed boards and other interconnecting structures. Reinforced base materials clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.5W/m K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
Edition 2018-04-16

Connectors for electronic equipment. Printed board connectors with assessed quality. Detail specification for two-part modular connectors, basic grid of 2,0 mm, with terminations on a multiple grid of 0,5 mm. Detail specification for two part modular connectors (with optional shielding plates) for printed boards and backplanes, basic grid 2,0 mm, with terminations on a multiple grid of 0,5 mm
Edition 1999-08-15

Graphic technology - Image quality evaluation methods for printed matter - Part 31: Evaluation of the perceived resolution of printing systems with the Contrast-Resolution chart
Edition 2024-01

Materials for printed boards and other interconnecting structures - Part 2-45 : reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.0W/m.K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
Edition 2018-03-23

Materials for printed boards and other interconnecting structures - Part 2-46 : reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.5W/m K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
Edition 2018-03-23

Connectors for electronic equipment - Part 4-107 : printed board connectors with assessed quality - Detail specification for shielded two-part connectors having a basic grid of 2,0 mm, fixed part with solder and press-in terminations for printed boards, free part with non-accessible insulation displacement and crimp terminations
Edition 2002-09-01

Materials for printed boards and other interconnecting structures - Part 2-42 : reinforced base materials clad and unclad - Brominated epoxide non-woven / woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Edition 2010-07-01

Materials for printed boards and other interconnecting structures - Part 4-16 : sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Edition 2014-02-01

Materials for printed boards and other interconnecting structures - Part 4-19 : sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - High performance, non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Edition 2014-03-19

Materials for printed boards and other interconnecting structures - Part 2-44 : reinforced base materials clad and unclad - Non halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Edition 2016-09-10