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SN EN 61249-2-10
Materials for printed boards and other interconnecting structures. Part 2-10: Reinforced base materials, clad and unclad - Cyanate ester, brominated epoxide, modified or unmodified, woven E-glass reinforced laminated sheets of defined flammability
Edition
2003-05
SN EN 60603-2/A1
Connectors for frequencies below 3 MHz for use with printed boards. Part 2: Detail specification for two-part connectors with assessed quality, for printed boards, for basic grid of 2,54 mm (0,1 in) with common mounting features
Edition
2005-05
SN EN IEC 61189-5-601
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-601: General test methods for materials and assemblies - Reflow soldering ability test for solder joint, and reflow heat resistance test for printed boards
Edition
2021-03
SN EN 61249-2-7
Materials for printed boards and other interconnecting structures. Part 2-7: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheet of defined flammability (vertical burning test), copper-clad
Edition
2002-06
VDI 4500 Blatt 6
Technical documentation - Documentation process - Publishing
Edition
2019-09
BS DD IEC/PAS 61249-3-1
Materials for printed boards and other interconnecting structures. Copper-clad laminates for flexible boards (adhesive and non-adhesive types)
Edition
2007-10-31
ISO/TS 15311-1
Graphic technology - Requirements for printed matter for commercial and industrial production - Part 1: Measurement methods and reporting schema
Edition
2020-12
ISO/TS 18621-21
Graphic technology - Image quality evaluation methods for printed matter - Part 21: Measurement of 1D distortions of macroscopic uniformity utilizing scanning spectrophotometers
Edition
2023-03
BS EN IEC 61249-2-47
Materials for printed boards and other interconnecting structures. Reinforced base materials clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2,0 W/(m K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
Edition
2018-04-18
BS EN IEC 61249-2-45
Materials for printed boards and other interconnecting structures. Reinforced base materials clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.0W/m K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
Edition
2018-04-13