Materials for printed boards and other interconnecting structures - Part 2-46: Reinforced base materials clad and unclad - Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.5W/m·K) and defined flammability (vertical burning test), copper-clad for lead-free assembly (Endorsed by Asociación Española de Normalización in May of 2018.)
Edition 2018-05-01

Materials for printed boards and other interconnecting structures - Part 6-3 : sectional specification set for reinforcement materials - Specification for finished fabric woven from "E" glass for printed boards
Edition 2023-08-04

Wearable electronic devices and technologies. Terminology
Edition 2021-09-15

Materials for printed boards and other interconnecting structures. Reinforced base materials clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity 2,0 W/(m K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
Edition 2018-04-18

Materials for printed boards and other interconnecting structures. Reinforced base materials clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.0W/m K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
Edition 2018-04-13

Materials for printed boards and other interconnecting structures. Reinforced base materials clad and unclad. Non-halogenated epoxide non-woven/woven E-glass reinforced laminate sheets of thermal conductivity (1.5W/m K) and defined flammability (vertical burning test), copper-clad for lead-free assembly
Edition 2018-04-16

Materials for printed boards and other interconnecting structures - Part 2-47: Reinforced base materials clad and unclad - Non-halogenated epoxide non woven/woven E-glass reinforced laminate sheets of thermal conductivity (2.0W/m.K) and defined flammability (vertical burning test), copper-clad for lead free assembly
Edition 2018-03-23

Materials for printed boards and other interconnecting structures. Sectional specification set for prepreg materials unclad (for the manufacture of multilayer boards). High performance non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Edition 2014-02-28

Materials for printed boards and other interconnecting structures. Reinforced base materials clad and unclad. Bismaleimide/triazine modified with non-halogenated epoxide woven glass laminate sheets of defined flammability (vertical burning test), copper-clad
Edition 2013-04-30

Materials for printed boards and other interconnecting structures. Reinforced base materials clad and unclad. Brominated epoxide non-woven / woven E-glass reinforced laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Edition 2010-06-30