Aerospace - Flat-conductor cable, unshielded, 300 V, 150 °C; Inactive for new design
Edition 2014-12

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:2013 + A1:2018); German version EN 60191-4:2014 + A1:2018
Edition 2019-02

Fibre optic active components and devices - Package and interface standards - Part 21: Design guidelines of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA) (IEC 62148-21:2021); German version EN IEC 62148-21:2021
Edition 2022-09

Micrographics - Transparent A6 microfiche - Image arrangements (ISO 9923:1994)
Edition 1999-09

Method for the determination of the space required by capacitors and resistors with unidirectional terminations (IEC 60717:2012); German version EN 60717:2012
Edition 2012-12

Printed boards and printed board assemblies - Design and use - Part 6-4: Land pattern design - Generic requirements for dimensional drawings of surface mounted components (SMD) from the viewpoint of land pattern design (IEC 61188-6-4:2019); German version EN IEC 61188-6-4:2019
Edition 2020-04

Refrigerating systems and heat pumps - System flow diagrams and piping and instrument diagrams - Layout and symbols; German version EN 1861:1998
Edition 1998-07

Outline dimensions of transformers and inductors for use in telecommunication and electronic equipment; part 1: transformers and inductors using YEI 1 laminations; identical with IEC 60852-1:1986
Edition 1990-09

Additive manufacturing of polymers - Qualification principles - Classification of part properties (ISO/ASTM 52924:2023); German version EN ISO/ASTM 52924:2023
Edition 2023-12

Organic light emitting diode displays - Part 1-2: Terminology and letter symbols (IEC 62341-1-2:2007); German version EN 62341-1-2:2009
Edition 2010-09