Miniature fuses - Part 4: universal modular fuse-links (UMF) - Through-hole and surface mount types
Edition 2013-10-11

Miniature fuses - Part 4: Universal modular fuse-links (UMF) - Through-hole and surface mount types (IEC 60127-4:2005 + A1:2008 + A2:2012) (german version)
Edition 2014-02-01

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices ((IEC 60749-15:2020) EN IEC 60749-15:2020) (german version)
Edition 2022-06-01

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling
Edition 2016-04

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling (IEC 61189-3-719:2016) (german version)
Edition 2017-01-01

Space product assurance - Repair and modification of printed circuit board assemblies for space use; English version EN 16602-70-28:2014
Edition 2015-06

Technical drawings - Simplified representation and dimensioning of holes (ISO 15786:2008)
Edition 2014-12

Quality assessment systems - Part 1: Registration and analysis of defects on printed board assemblies (IEC 61193-1:2001); German version EN 61193-1:2002
Edition 2002-07

Circuit boards and circuit board assemblies - Design and use - Part 6-1: Land pattern design - Generic requirements for land pattern on circuit boards (IEC 61188-6-1:2021); German version EN IEC 61188-6-1:2021
Edition 2022-08

Star grips
Edition 2008-05