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Standards [CURRENT]

DIN EN 10288

Steel tubes and fittings for on and offshore pipelines - External two layer extruded polyethylene based coatings; German version EN 10288:2002
Edition 2003-12

Standards [CURRENT]

DIN EN IEC 61755-1

Fibre optic interconnecting devices and passive components - Connector optical interfaces for single-mode fibres - Part 1: Optical interfaces for dispersion unshifted fibres - General and guidance (IEC 61755-1:2022); German version EN IEC 61755-1:2022
Edition 2023-07

Standards [CURRENT]

DIN EN 62569-1

Generic specification of information on products by properties - Part 1: Principles and method (IEC 62569-1:2017); German version EN 62569-1:2017
Edition 2018-06

Standards [CURRENT]

DIN EN 62607-3-1

Nanomanufacturing - Key control characteristics - Part 3-1: Luminescent nanomaterials - Quantum efficiency (IEC 62607-3-1:2014); German version EN 62607-3-1:2014
Edition 2014-12

Standards [CURRENT]

DIN EN 61391-2

Ultrasonics - Pulse-echo scanners - Part 2: Measurement of maximum depth of penetration and local dynamic range (IEC 61391-2:2010); German version EN 61391-2:2010
Edition 2010-09

Standards [CURRENT]

DIN EN IEC 62942

File format for professional transfer and exchange of digital audio data (IEC 62942:2019); German version EN IEC 62942:2020
Edition 2020-09

Standards [CURRENT]

DIN EN 61753-2-3

Fibre optic interconnecting devices and passive components performance standard - Part 2-3: Non-connectorised single-mode 1×N and 2×N non-wavelength-selective branching devices for category U; Uncontrolled environment (IEC 61753-2-3:2001); German version EN 61753-2-3:2001
Edition 2002-08

Standards [CURRENT]

DIN EN IEC 60749-37

Semiconductor devices - Mechanical and climatic test methods - Part 37: Board level drop test method using an accelerometer (IEC 60749-37:2022); German version EN IEC 60749-37:2022
Edition 2023-12

Standards [CURRENT]

DIN 14024-1

Digital BOS-Radio systems - Part 1: Design and operation
Edition 2021-12

Standards [CURRENT]

DIN EN 60191-4

Mechanical standardization of semiconductor devices - Part 4: Coding system and classification into forms of package outlines for semiconductor device packages (IEC 60191-4:2013 + A1:2018); German version EN 60191-4:2014 + A1:2018
Edition 2019-02

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