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Standards [CURRENT]

IPC 4554

Specification for Immersion Tin Plating for Printed Circuit Boards
Edition 2012-01-01

Standards [CURRENT]

IPC 4554 AMD 1

Specification for Immersion Tin Plating for Printed Circuit Boards; Amendment 1
Edition 2012-01-09

Standards [CURRENT]

IPC 4555

Performance Specification for High Temperature Organic Solderability Preservatives (OSP) for Printed Boards
Edition 2022-04-01

Standards [CURRENT]

IPC 4556

Specification for Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) Plating for Printed Circuit Boards
Edition 2013-02-04

Standards [CURRENT]

IPC 4556 AMD 1

Specification for Electroless Nickel/Electroless Palladium/ Immersion Gold (ENEPIG) Plating for Printed Circuit Boards
Edition 2016-01-01

Standards [CURRENT]

IPC 4562B

Metal Foil for Printed Board Applications
Edition 2023-10-01

Standards [CURRENT]

IPC 4563

Resin Coated Copper Foil for Printed Boards Guideline
Edition 2008-02-11

Standards [CURRENT]

IPC 4591A

Requirements for Printed Electronics Functional Conductive Materials
Edition 2018-01-01

Standards [CURRENT]

IPC 4592

Requirements for Printed Electronics Functional Dielectric Materials
Edition 2022-08-01

Standards [CURRENT]

IPC 4761

Design Guide for Protection of Printed Board Via Structures
Edition 2006-07-20

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