Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling (IEC 61189-3-719:2016); German version EN 61189-3-719:2016
Edition 2016-12

Fibre optic interconnecting devices and passive components - Fibre optic connector interfaces - Part 1: General and guidance (IEC 61754-1:2013); German version EN 61754-1:2013
Edition 2014-05

Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 3-50: Examinations and measurements - Crosstalk for optical spatial switches (IEC 61300-3-50:2013); German version EN 61300-3-50:2013
Edition 2014-02

Fibre optic interconnecting devices and passive components - Fibre optic connector interfaces - Part 27: Type M12-FO connector family (IEC 61754-27:2013); German version EN 61754-27:2013
Edition 2014-03

Liquid crystal display devices - Part 2-1: Passive matrix monochrome LCD modules - Blank detail specification (IEC 61747-2-1:2013); German version EN 61747-2-1:2013
Edition 2014-02

Packaging of components for automatic handling - Part 4: Stick magazines for electronic components encapsulated in packages of different forms (IEC 60286-4:2013); German version EN 60286-4:2013
Edition 2014-04

Semiconductor devices - Micro-electromechanical devices - Part 18: Bend testing methods of thin film materials (IEC 62047-18:2013); German version EN 62047-18:2013
Edition 2014-04

Liquid crystal display devices - Part 10-1: Environmental, endurance and mechanical test methods - Mechanical (IEC 61747-10-1:2013); German version EN 61747-10-1:2013
Edition 2014-06

Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 2-7: Tests - Bending moment (IEC 61300-2-7:2013); German version EN 61300-2-7:2013
Edition 2014-03

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 11: Measurement of melting temperature or melting temperature ranges of solder alloys (IEC 61189-11:2013); German version EN 61189-11:2013
Edition 2014-02