Connectors for frequencies below 3 MHz for use with printed boards. Part 9: Two-part connectors for printed boards, backpanels and cable connectors, basic grid of 2,54 mm (0,1 in)
Edition 1998-01

Connectors for frequencies below 3 MHz for use with printed boards. Part 10: Two-part connectors for printed boards for basic grid of 2,54 mm (0,1 in), inverted type
Edition 1998-01

Graphic technology - Print quality requirements for printed matter - Part 2: Commercial print applications utilizing digital printing technologies
Edition 2018-10

Graphic technology - Image quality evaluation methods for printed matter - Part 11: Colour gamut analysis
Edition 2022-04

Graphic technology - Image quality evaluation methods for printed matter - Part 22: Evaluation of colour graininess
Edition 2024-05

Materials for printed boards and other interconnecting structures - Reinforced base materials, clad and unclad - Modified epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Edition 2009-04-30

Materials for printed boards and other interconnecting structures - Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Edition 2009-04-30

Materials for printed boards and other interconnecting structures - Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Edition 2009-06-30

Materials for printed boards and other interconnecting structures - Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Edition 2009-10-31