Industrial-process control valves - Part 3-1: Dimensions - Face-to-face dimensions for flanged, two-way, globe-type, straight pattern and centre-to-face dimensions for flanged, two-way, globe-type, angle pattern control valves (IEC 60534-3-1:2019); German version EN IEC 60534-3-1:2019
Edition 2019-11

Fibre optic interconnecting devices and passive components - Connector optical interfaces - Part 6-2: Connection of 50 µm core diameter multimode physically contacting fibres - Non-angled for reference connector application, at wavelength of 850 nm using selected A1a fibre only (IEC 61755-6-2:2018); German version EN IEC 61755-6-2:2018
Edition 2019-06

Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 2-55: Tests - Strength of mounted adaptor (IEC 61300-2-55:2017); German version EN 61300-2-55:2017
Edition 2018-01

Measurement techniques of piezoelectric, dielectric and electrostatic oscillators - Part 3: Frequency aging test methods (IEC 62884-3:2018); German version EN IEC 62884-3:2018
Edition 2018-10

Semiconductor devices - Mechanical and climatic test methods - Part 13: Salt atmosphere (IEC 60749-13:2018); German version EN IEC 60749-13:2018
Edition 2018-10

Ferrite cores - Guidelines on dimensions and the limits of surface irregularities - Part 7: EER-cores (IEC 63093-7:2018); German version EN IEC 63093-7:2018
Edition 2018-12

Industrial-process measurement and control - Data structures and elements in process equipment catalogues - Part 24-3: Lists of properties (LOPs) of flow modification accessories for electronic data exchange (IEC 61987-24-3:2017); German version EN 61987-24-3:2017
Edition 2018-12

Interoperability specifications of common external power supply (EPS) for use with data-enabled mobile telephones (IEC 62684:2018); German version EN IEC 62684:2018
Edition 2018-12

Thermocouples - Part 3: Extension and compensating cables - Tolerances and identification system (IEC 60584-3:2021); German version EN IEC 60584-3:2021
Edition 2022-02

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices (IEC 60749-15:2020); German version EN IEC 60749-15:2020
Edition 2022-05