Mechanical standardization of semiconductor devices - Part 6-18: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
Edition 2010-02

Mechanical Standardization Of Semiconductor Devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array andSili
Edition 2013-03

Fibre optic active components and devices - Package and interface standards - Part 21: design guidelines of electrical interface of PIC packages using silicon fine-pitch ball grid array (S-FBGA) and silicon fine-pitch land grid array (S-FLGA)
Edition 2021-06-04

Mechanical standardization of semiconductor devices - Part 6-4 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA)
Edition 2003-11-01

Mechanical standardization of semiconductor devices - Part 6-5 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for fine-pitch ball grid array (FBGA)
Edition 2002-08-01

Mechanical standardization of semiconductor devices - Part 6-13 : design guideline of open-top-type sockets for fine-pitch ball grid array (FBGA) and fine-pitch land grid array (FLGA)
Edition 2017-01-14

Mechanical standardization of semiconductor devices - Part 6-17 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for stacked packages - Fine-pitch ball grid array and fine-pitch land grid array (P-PFBGA and P-PFLGA)
Edition 2012-10-01

Mechanical standardization of semiconductor devices - Part 6-18 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for ball grid array (BGA)
Edition 2010-08-01

Mechanical standardization of semiconductor devices - Part 6-22 : general rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (SFBGA and S-FLGA)
Edition 2013-09-14

Electrical relays - Tests and Measurements - Part 56: Ball Pressure Test