Search results
Search list
Results in:
NF C96-022-15 ; NF EN IEC 60749-15:2020-09-25
Semiconductor devices - Mechanical and climatic test methods - Part 15: resistance to soldering temperature for through-hole mounted devices
Edition
2020-09-25
SN EN IEC 61760-3
Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering
Edition
2021-03
NF C60-433/A1 ; NF EN 60127-4/A1:2013-01-26
Miniature fuses - Part 4: universal modular fuse-links (UMF) - Through-hole and surface mount types
Edition
2013-01-26
SN EN 60127-4
Miniature fuses. Part 4: Universal Modular Fuse-links (UMF) (Through-hole and surface mount types)
Edition
2005-04
DIN EN 61189-3-719
Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling (IEC 61189-3-719:2016); German version EN 61189-3-719:2016
Edition
2016-12
OVE EN IEC 61760-3
Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering (german version)
Edition
2022-08-01
SN EN IEC 60749-15
Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
Edition
2020-09
OVE EN 61191-3
Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies (IEC 61191-3:2017) (german version)
Edition
2018-06-01
SN EN 60127-4+A1+A2
Miniature fuses - Part 4: Universal modular fuse-links (UMF) - Through-hole and surface mount types
Edition
2009-02
NF C60-433 ; NF EN 60127-4:2005-08-01
Miniature fuses - Part 4: universal modular fuse-links (UMF) - Through-hole and surface mount types
Edition
2005-08-01