Semiconductor devices - Mechanical and climatic test methods - Part 15: resistance to soldering temperature for through-hole mounted devices
Edition 2020-09-25

Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering
Edition 2021-03

Miniature fuses - Part 4: universal modular fuse-links (UMF) - Through-hole and surface mount types
Edition 2013-01-26

Miniature fuses. Part 4: Universal Modular Fuse-links (UMF) (Through-hole and surface mount types)
Edition 2005-04

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 3-719: Test methods for interconnection structures (printed boards) - Monitoring of single plated-through hole (PTH) resistance change during temperature cycling (IEC 61189-3-719:2016); German version EN 61189-3-719:2016
Edition 2016-12

Surface mounting technology - Part 3: Standard method for the specification of components for through-hole reflow (THR) soldering (german version)
Edition 2022-08-01

Semiconductor devices - Mechanical and climatic test methods - Part 15: Resistance to soldering temperature for through-hole mounted devices
Edition 2020-09

Printed board assemblies - Part 3: Sectional specification - Requirements for through-hole mount soldered assemblies (IEC 61191-3:2017) (german version)
Edition 2018-06-01

Miniature fuses - Part 4: Universal modular fuse-links (UMF) - Through-hole and surface mount types
Edition 2009-02

Miniature fuses - Part 4: universal modular fuse-links (UMF) - Through-hole and surface mount types
Edition 2005-08-01