Mechanical standardization of semiconductor devices - Part 6-22: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guide for semiconductor packages Silicon Fine-pitch Ball Grid Array and Silicon Fine-pitch Land Grid Array (S-FBGA and S-FLGA) (IEC 60191-6-22:2012) (german version)
Edition 2013-10-01

Connectors for electronic equipment - Product requirements - Part 3-115: Rectangular connectors - Detail specification for protective housings for use with 8-way shielded and unshielded connectors for frequencies up to 600 MHz for industrial environments incorporating the IEC 60603-7 series interface - Variant 12 related to IEC 61076-3-106 - Push-pull type (IEC 61076-3-115:2009) (german version)
Edition 2011-08-01

Fibre optic interconnecting devices and passive components - Performance standard - Part 051-02: Plug-receptacle style single-mode fibre fixed optical attenuators for category C - Controlled environments (( IEC 61753-051-02:2022) EN IEC 61753-051-02:2022) (german version)
Edition 2024-02-01

Connector sets and interconnect components to be used in optical fibre communication systems - Product specifications - Part 4-3: Type SC/APC simplex 9° terminated on EN 60793-2-50 of type B-652.D and B-657.A singlemode fibre with full zirconia ferrule, category OP (german version)
Edition 2024-02-01

Fibre optic interconnecting devices and passive components - Performance standard - Part 053-02: Non-connectorized, single-mode fibre, electrically controlled, variable optical attenuator for category C - Controlled environments (( IEC 61753-053-02:2022) EN IEC 61753-053-02:2022) (german version)
Edition 2024-02-01

Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (IEC 61249-4-14:2009) (german version)
Edition 2010-01-01

Materials for printed boards and other interconnecting structures - Part 4-16: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (IEC 61249-4-16:2009) (german version)
Edition 2010-01-01

Materials for printed boards and other interconnecting structures - Part 4-17: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Non-halogenated epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (IEC 61249-4-17:2009) (german version)
Edition 2010-01-01

Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly (IEC 61249-4-15:2009) (german version)
Edition 2010-01-01

Connectors for electronic equipment - Product requirements - Part 3-114: Rectangular connectors - Detail specification for protective housings for use with 8-way shielded and unshielded connectors for frequencies up to 600 MHz for industrial environments incorporating the IEC 60603-7 series interface - Variant 11 related to IEC 61076-3-106 - Bayonet coupling type (IEC 61076-3-114:2009) (german version)
Edition 2010-02-01