Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-2: General test methods for materials and assemblies - Soldering flux for printed board assemblies (IEC 61189-5-2:2015) (german version)
Edition 2015-12-01

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-3: General test methods for materials and assemblies - Soldering paste for printed board assemblies (IEC 61189-5-3:2015) (german version)
Edition 2015-12-01

Test methods for electrical materials, printed boards and other interconnection structures and assemblies - Part 5-4: General test methods for materials and assemblies - Solder alloys and fluxed and non-fluxed solid wire for printed board assemblies (IEC 61189-5-4:2015) (german version)
Edition 2015-12-01

Building works - Execution of underlays for roofing - Part 1-1 : Contract bill of technical model clauses - Part 1-2 : General criteria for choice of materials - Part 2: Contract bill of technical model clauses
Edition 2015-11-28

Shunt power capacitors of the self-healing type for a.c. systems having a rated voltage up to and including 1000 V - Part 1: General - Performance, testing and rating - Safety requirements - Guide for installation and operation (IEC 60831-1:2014 + Cor.:2014) (german version)
Edition 2014-12-01

Building works - Applied stone wall cladding - Part 1-1 : Contract bill of technical model clauses - Part 1-2 : General criteria for selection of materials - Part 2: Contract bill of special administrative model clauses
Edition 2014-12-12

Mechanical standardization of semiconductor devices - Part 6-12: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Design guidelines for fine-pitch land grid array (FLGA) (IEC 60191-6-12:2011) (german version)
Edition 2012-02-01

Mechanical standardization of semiconductor devices - Part 6-21: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline packages (SOP) (IEC 60191-6-21:2010)
Edition 2011-05-01

Mechanical standardization of semiconductor devices - Part 6-20: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of small outline J-lead packages (SOJ) (IEC 60191-6-20:2010)
Edition 2011-05-01

Electromagnetic compatibility (EMC) - Part 4-7: Testing and measurement techniques - General guide on harmonics and interharmonics measurements and instrumentation, for power supply systems and equipment connected thereto (IEC 61000-4-7:2002 + A1:2008) (german version)
Edition 2010-02-01