Semiconductor devices - Mechanical and climatic test methods - Part 1: General (IEC 60749-1:2002 + Corr. 1:2003); German version EN 60749-1:2003
Edition 2003-12

Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA) (IEC 60191-6-4:2003); German version EN 60191-6-4:2003
Edition 2004-01

Environmental testing - Part 2-43: Tests - Test Kd: Hydrogen sulphide test for contacts and connections (IEC 60068-2-43:2003); German version EN 60068-2-43:2003
Edition 2004-04

Environmental testing - Part 2-42: Tests - Test Kc: Sulphur dioxide test for contacts and connections (IEC 60068-2-42:2003); German version EN 60068-2-42:2003
Edition 2004-04

Radio frequency and coaxial cable assemblies - Part 2-2: Blank detail specification for flexible coaxial cable assemblies (IEC 60966-2-2:2003); German version EN 60966-2-2:2003
Edition 2004-06

Radio frequency and coaxial cable assemblies - Part 4-1: Blank detail specification for semi-rigid coaxial cable assemblies (IEC 60966-4-1:2003); German version EN 60966-4-1:2003
Edition 2004-06

Radio frequency and coaxial cable assemblies - Part 3-2: Detail specification for semi-flexible coaxial cable assemblies for GSM use (0,8 GHz - 1 GHz) (IEC 60966-3-2:2003); German version EN 60966-3-2:2003
Edition 2004-06

Industrial-process control valves - Part 5: Marking (IEC 60534-5:2004); German version EN 60534-5:2004
Edition 2004-09

Surface acoustic wave (SAW) filters of assessed quality - Part 3: Standard outlines (IEC 60862-3:2003); German version EN 60862-3:2003
Edition 2004-08

Semiconductor devices - Mechanical and climatic test methods - Part 33: Accelerated moisture resistance - Unbiased autoclave (IEC 60749-33:2004); German version EN 60749-33:2004
Edition 2004-09