Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 2-40: Tests; Screen testing of attenuation of single-mode tuned angled optical connectors (IEC 61300-2-40:2000); German version EN 61300-2-40:2000
Edition 2001-10

Mechanical standardization of semiconductor devices - Part 6-10: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Dimensions of P-VSON (IEC 60191-6-10:2003); German version EN 60191-6-10:2003
Edition 2004-05

Packaging of winding wires - Part 2-3: Cylindrical barrelled delivery spools - Specification for non-returnable spools made from thermoplastic material (IEC 60264-2-3:1990 + A1:2003); German version EN 60264-2-3:1994 + A1:2004
Edition 2004-10

Packaging of winding wires - Part 3-3: Taper barrelled delivery spools - Specification for non-returnable spools made from thermoplastic material (IEC 60264-3-3:1990 + A1:2003); German version EN 60264-3-3:1994 + A1:2004
Edition 2004-10

Packaging of winding wires - Part 4-2: Methods of test - Containers made from thermoplastic material for taper barrelled delivery spools (IEC 60264-4-2:1992 + A1:2003); German version EN 60264-4-2:1994 + A1:2004
Edition 2004-10

Fixed resistors for use in electronic equipment - Part 9-1: Blank detail specification - Fixed surface mount resistor networks with individually measurable resistors - Assessment level EZ (IEC 60115-9-1:2003); German version EN 60115-9-1:2004
Edition 2004-10

Fibre optic interconnecting devices and passive components - Basic test and measurement procedures - Part 3-31: Examinations and measurements; Coupled power ratio measurement for fibre optic sources (IEC 61300-3-31:2003); German version EN 61300-3-31:2003
Edition 2003-11

Semiconductor devices - Mechanical and climatic test methods - Part 1: General (IEC 60749-1:2002 + Corr. 1:2003); German version EN 60749-1:2003
Edition 2003-12

Mechanical standardization of semiconductor devices - Part 6-4: General rules for the preparation of outline drawings of surface mounted semiconductor device packages - Measuring methods for package dimensions of ball grid array (BGA) (IEC 60191-6-4:2003); German version EN 60191-6-4:2003
Edition 2004-01

Environmental testing - Part 2-43: Tests - Test Kd: Hydrogen sulphide test for contacts and connections (IEC 60068-2-43:2003); German version EN 60068-2-43:2003
Edition 2004-04