Mechanical standardization of semiconductor devices - Part 6-19: Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage (Endorsed by AENOR in September of 2010.)
Edition 2010-09-01

Mechanical standardization of semiconductor devices - Glossary of semiconductor tests and burn-in sockets for BGA, LGA, FBGA and FLGA
Edition 2007-07-31

Mechanical standardization of semiconductor devices. Measurement methods of the package warpage at elevated temperature and the maximum permissible warpage
Edition 2010-06-30

Mechanical standardization of semiconductor devices - Part 6-19 : measurement methods of package warpage at elevated temperature and the maximum permissible warpage
Edition 2010-11-01

Mechanical standardization of semiconductor devices - Part 6-16 : glossary of semiconductor test and burn-in sockets for BGA, LGA, FBGA and FLGA
Edition 2013-01-05

Standard Test Method for Determining Resistance of Photovoltaic Modules to Hail by Impact with Propelled Ice Balls
Edition 2010

Standard Practice for Determining Resistance of Solar Collector Covers to Hail by Impact with Propelled Ice Balls
Edition 1992

Fine ceramics (advanced ceramics, advanced technical ceramics) - Silicon nitride materials for rolling bearing balls and rollers
Edition 2017-10

Football goals - Code of practice for their procurement, installation, maintenance, storage and inspection
Edition 2005-10-11

Paints and varnishes - Determination of viscosity using rotational viscometers - Part 2: Relative measurement of viscosity using disc or ball spindles at specified speeds (ISO/DIS 2884-2:2023)
Edition 2023-09-15