Connectors for frequencies below 3 MHz for use with printed boards. Part 14: Detail specification for circular connectors for low-frequency audio and video applications such as audio, video and audio-visual equipment
Edition 1999-06

Connectors for frequencies below 3 MHz for use with printed boards. Part 12: Detail specification for dimensions, general requirements and tests for a range of sockets designed for use with integrated circuits
Edition 1998-01

Connectors with assessed quality, for use in d.c., low-frequency analogue and in digital high-speed data applications. Part 4: Printed board connectors. Section 001: Blank detail specification
Edition 1996-11

Connectors for electronic equipment - Product requirements - Part 4-116: Printed board connectors - Detail specification for a high-speed two-part connector with integrated shielding function
Edition 2012-06

Environmental labels and declarations - Self-declared environmental claims (Type II environmental labelling) - Carbon footprint, carbon neutral (ISO 14021:2016/Amd 1:2021); Amendment A1
Edition 2021-08

Materials for printed boards and other interconnecting structures - Part 2-38: Reinforced base materials, clad and unclad - Non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Edition 2009-03

Materials for printed boards and other interconnecting structures - Part 2-37: Reinforced base materials, clad and unclad - Modified non-halogenated epoxide woven E-glass laminate sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Edition 2009-03

Materials for printed boards and other interconnecting structures - Part 4-14: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Edition 2009-06

Materials for printed boards and other interconnecting structures - Part 4-15: Sectional specification set for prepreg materials, unclad (for the manufacture of multilayer boards) - Multifunctional epoxide woven E-glass prepreg of defined flammability (vertical burning test) for lead-free assembly
Edition 2009-06

Materials for printed boards and other interconnecting structures - Part 2-36: Reinforced base materials clad and unclad - Epoxide woven E-glass laminated sheets of defined flammability (vertical burning test), copper-clad for lead-free assembly
Edition 2009-03